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Low Surface Prep: Bonds effectively with little to no substrate preparation
Loctite™ 7113 Cyanoacrylate Instant Adhesive Accelerator
and Composite Bonding
Softening Point: 239°F approx
InfinityPACK Plus E1370 Packaging Hot Melt for Difficult Substrates type-consumer-hot-glue-stick Low Surface Prep: Bonds effectivelyIntroducing InfinityPACK Plus E1370 Packaging Hot Melt for Difficult Substrates InfinityPACK Plus is a high performance packaging hot melt adhesive that is superior for coated stocks and substrates. Infinity Bond E1370 is very heat stable with clean machining properties. E1370 also offers excellent high and low temperature bond performance. InfinityPACK Plus is excellent for tray forming and case carton sealing applications. Online pricing is for a 40
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