Micron Technology DRAM SDRAM-DDR3L, Part #: MT40A1G16KNR-075:E | Dynamic random access memory | DEX TE Connectivity SKIIP3 2413 GB123+WATER COOLIN

SKIIP3 2413 GB123+WATER COOLIN

1K/2K/4K bytes EEPROM

Output Power into 8Ω at VCC = Peak Instantaneous Temperature (°Ke) (SPiKe) ±35V protection circuitry

Xiilnx FPGA Part #XC3S1200E-5FT256C

Micron Technology DRAM SDRAM-DDR3L, Part #: MT40A1G16KNR-075:E | Dynamic random access memory | DEX TE Connectivity SKIIP3 2413 GB123+WATER COOLINMicron Technology DRAM SDRAM DDR4, Part #: MT40A1G16KNR 075: E features: Uses two x8 8Gb Micron die to make one x16 Single rank TwinDie VDD = VDDQ = 1. 2V (1. 141. 26V) 1. 2V VDDQ terminated I O JEDEC standard ball out Low profile package TC of 0C to 95C 0C to 85C: 8192 refresh cycles in 64ms 85C to 95C: 8192 refresh cycles in 32ms MIL: MT40A1G16KNR 075 E MT40A1G16KNR 075: E